Varian Semiconductor Equipment, Company

The Applied Producer Nanocure 3 is designed to work with the Applied Producer Black Diamond 3 deposition system to extend Applied's leadership in nano-porous low-κ dielectric technology to enable the scaling of advanced interconnects to 28nm and below. Black Diamond II nano-porous low-k film is the...

Applied Producer Black Diamond 3 extends Applied's leadership in nano-porous low-k dielectric technology to enable the scaling of advanced interconnects to 28nm and below. The Black Diamond II nano-porous low-k film is the industry standard for the 45/32nm copper/low-k interconnects, with a...

The Applied Aera3 Mask Inspection system introduces unique capabilities for qualifying the full range of masks used for 22nm logic/32nm memory technology nodes and for early learning EUV mask inspection. It is a third generation production-worthy inspection tool that uses true aerial imaging with a...

The Applied Producer APF (Advanced Patterning Film) PECVD (Plasma-Enhanced Chemical Vapor Deposition) system delivers breakthrough strippable amorphous carbon hard mask technology for critical patterning steps. Running at virtually every advanced DRAM, NAND flash, and NOR flash manufacturing site,...

Electro-chemical deposition (ECD) is a rapid and cost-effective method used to lay down the bulk of the copper wiring in semiconductor device manufacturing. The wiring is used to create the interconnects needed to form the electrical circuits. For the circuit to function properly, it is essential...

As devices become more complex, incorporating a wider variety of materials and a growing number of film layers, demands on chemical-mechanical polishing (CMP) technology for enhanced removal uniformity, greater productivity, and lower costs continually expand. Future applications, such as 3D memory...

Conventional DRAM designs surround each storage capacitor with its control circuitry and address lines. To pack more bits onto each chip, leading memory makers are instead burying the address lines underneath the capacitor in the silicon wafer. Applied has met this new design challenge with a full...

The Trident platform combines patented dual-magnet ribbon beam architecture with an innovative energy purity module (EPM) to deliver sharp, controlled implant profiles. The EPM also effectively filters particles generated from beam line elements, effectively isolating the wafer from such...

The VIISta 900XP sets the standard for precision, cleanliness, productivity, and production worthiness in the medium current ion implant market. In addition, the extended energy range of the 900XP makes it the most productive solution for sub-MeV well applications.

The Applied Centris AdvantEdge Mesa is Applied's most advanced silicon etch system, delivering the precision, intelligence, and productivity needed for the successful fabrication of advanced logic and memory chips at 22nm and below. Featuring Applied's industry-leading AdvantEdge Mesa etch chamber...